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5090660 SOLDER WIRE, LEAD FREE, 1.2MM, 500G
Κατασκευαστής: MULTICOMP
Part Number:509-0660

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SOLDER WIRE, LEAD FREE, 1.2MM, 500G; Flux Type:No Clean and Rosin Flux; Solder Alloy:99.3, 0.7 Sn, Cu; External Diameter - Metric:1.2mm; External Diameter - Imperial:0.047"; Melting Temperature:227?C; Weight - Metric:500g; Weight - Imperial:1.102lb; Product Range:-; SVHC:No SVHC (07-Jul-2017); Bit Temperature:350?C; Bit Temperature Max:370?C; Bit Temperature Min:350?C; External Diameter:1.2mm; Material Composition:Lead Free, 99.3% Tin, 0.7% Copper Alloy; Outer Diameter:1.2mm; Weight:500g; Wire Diameter:1.2mm



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