ADAPTOR, SMD, TSSOP-24, 0.65MM; Convert From:-; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:2.54mm; Product Range:-; SVHC:No SVHC (15-Jan-2019); Board Connector / Footprint:TSSOP-24; Board Material:Epoxy Glass Composite; Board Thickness:1.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem. Au 0.08 - 0.1 ?m; Copper Thickness:35?m; External Height:18.5mm; External Length / Height:18.5mm; External Width:23.5mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:24; PCB Size:18.5 x 23.5 mm; Pad Diameter:1.5mm
RoHS: Όχι
| |